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Full SiC power modules

#One choice in SiC power modules

The worlds industries are growing fast and the demand of innovative and reliable technologies is increasing. Technical requirements of tomorrow will not be the same as they are today. 

SiC opens up a lot of possibilities for costs-, size- and performance improvements at system level. This is especially true for high-switching frequency applications. However, implementation of SiC comes with several challenges requiring best-in-class packaging.

To make the most out of SiC, it requires:

Customized, low-inductive package and pin-out allowing high switching speeds

Advanced bonding and joining technology (Danfoss Bond Buffer®) 

Dedicated cooling technology (ShowerPower®)

FAQs

Engineering SiC power modules can be challenging. To overcome the challenges, experience in electrical, thermal and mechanical design is key. Utilize our proven SiC track record and work together with our application experts to take your SiC application to the next level. 

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For further information please contact us