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Scaling Innovation for the AI Era with Danfoss at OCP Global Summit

Start: 2026-10-12T00:00:00Z
End: 2026-10-15T00:00:00Z

Date: 12 - 15 October, 2026
Location: San Jose Convention Center, California, US Booth: A11

Meet Danfoss at OCP Global Summit 2026

Join Danfoss at OCP Global Summit in San Jose, California presenting as an Emerald Sponsor. Discover how we're helping data center operators, hyperscalers, and infrastructure providers build the next generation of sustainable, scalable AI-ready facilities.

As power demands and rack densities continue to increase, liquid cooling has become a critical enabler for high-performance computing and AI infrastructure. Visit Booth A11 to connect with our experts, explore our latest cooling innovations, and discuss strategies for accelerating deployment while improving reliability and operational efficiency.

#OCPGlobalSummit #OCP2026 #OpenComputeProject

Featured executive session

The Hidden Drivers of Scalable Liquid Cooling Infrastructure: Interoperability, Traceability, and Ecosystem Alignment

Monday, October 12

12:00 PM Pacific Time

Location: SJCC - Lower Level - LL20BCD

As rack densities rise and deployment timelines compress, scaling liquid cooling infrastructure requires more than advances in cooling technology alone. Reliable deployment increasingly depends on interoperability, specification alignment, cleanliness management, traceability, and coordination across a complex ecosystem of manufacturers, integrators, contractors, and operators.

This presentation examines the engineering and operational practices required to scale liquid cooling from pilot deployments to repeatable, industry-wide implementation. Drawing on lessons learned from large-scale deployments, it explores how standardization, ecosystem collaboration, and disciplined execution can reduce integration risk, improve deployment consistency, and accelerate the delivery of AI-ready capacity.

Meet our expert

Sébastien Lafond Danfoss Power Solutions Senior Director of Engineering, Data Centers

Sébastien Lafond is a recognized leader in data center cooling innovation, helping organizations address the challenges of scaling AI and high-performance computing infrastructure. With deep expertise in liquid cooling technologies and ecosystem collaboration, he works closely with industry partners to advance reliable, efficient, and sustainable cooling solutions for the data center industry.

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