Brian Rowden, NAM Application Engineer at Danfoss Silicon Power US, won the “Early Career Award” for his outstanding professional leadership from the College of Engineering at the University of Arkansas.
The Alumni Awards
Arkansas Alumni Association was founded from the first graduating classes of the University of Arkansas. Today, after more than 100 years the Alumni Association has an extremely strong network.
Every year the Alumni awards are held to honor and highlight graduates from the University of Arkansas at all stages of their careers. The awardees are leaders who have used their experience and dedication to achieve distinction in their fields since graduating from the University of Arkansas.
On 13th of April more than 200 people from the Alumni Network gathered at the Alumni Awards to celebrate the accomplishments of the college’s graduates.
Brian Rowden was awarded for the “Early Career Award” that recognizes recent College of Engineering graduates that make outstanding contributions to their communities and show a significant promise for professional leadership in state, national, and international activities. This award is given to leaders, who served 15 years or less in their industries.
Being an Alumni, this award is special to Brian: “I am very honored and humbled to be nominated and receive this award on behalf of the Electrical Engineering department from the University of Arkansas. As a recognition of contributions in professional and community activities, this represents more than a personal contribution but that of so many supporters around me from my wife and boys to the great professional teams that I have been privileged to be a part. I would not be the person that I am today without this great network so thank you all.” – Brian Rowden
About Brian Rowden
Brian Rowden received his MS and PhD in electrical engineering from the University of Arkansas in the broad field of power electronics and thermal management. During his time in Arkansas, he worked for the National Center for Reliable Electric Power Transmission as the Power Packaging Project leader and was a member of the 2009 R&D 100 Award team for high temperature SiC packaging. He was a partner and principle investigator for Power Electronics Leveling Solutions LLC focused on multiple SBIR Phase I/II research on integrated thermal management systems.
In 2010, he joined GE Global Research as an Electrical Engineer in the Electronics and Miniaturization Lab and in 2013 became a Senior Engineer in the SiC Power Packaging Lab. In this position, he received the 2014 GE MNST Individual Technical Excellence Award and the 2014 GE PCD Team Technical Achievement Award. He has 9 patents issued with multiple applications pending.
In 2018, Brian joined Danfoss Silicon Power US to support Applications Engineering in North America and support the local Utica factory. In 2019, he was also inducted into the Arkansas Academy of Electrical Engineers for his professional and community service activities.
