Developments within automotive technology are ever more centered around the electrification of the drivetrain and demand for high quality igbt and silicon carbide power modules is increasing rapidly. A key approach to meeting the stringent automotive requirements and speeding up the time-to-market is the development of a new power module technology platform.
That is why Danfoss is introducing the new DCM™ technology platform which is especially suited to match the technical design challenges of automotive traction inverters for HEV/EVs. The DCM™ technology platform comprise of Danfoss’ market leading technologies: Danfoss Bond Buffer® that combines sintered die attach and copper wire bonding, transfer molding processes for robust packages, to liquid cooling technologies namely ShowerPower® and SP3D®.
The DCM™ is a robust, chip independent technology platform and designed for Si and SiC semiconductors. The technology platform is well-defined, based on proven technologies, and yet scalable and customized to meet specific requirements.
The DCM™1000 power module covers 750V semiconductors in silicon (Si), and the DCM™1000X covers 1200V semiconductors, either in Si or silicon carbide (SiC). Both are designed to operate under harshest conditions and includes Danfoss Bond Buffer®, Shower Power 3D® and transfer molding.
Read more about the new, innovative DCM™ technology platform