Technology and Innovation
In Danfoss, we continue to invest a large percentage of our turnover into our passionate staff and their groundbreaking research and development efforts. Also, we invest heavily in our relationships. We believe that most innovative solutions come from direct cooperation with our customers and partnerships with universities.
By offering expertise and experience in innovative design, manufacturing and delivery we are able to consistently deliver highly reliable, fully customized power modules and associated cooling concepts. Get in touch with our application experts and discover how our latest technologies can take your application to the next level.
Danfoss Bond Buffer®
Innovative new technology increases reliability, performance, lifetime and current density
In many industrial and automotive applications, reliability and longevity of components is critical. Traditional solutions suffer from limited reliability due to solder layers and aluminium wire bonds. By using unique sintering techniques and using copper instead of aluminium wires along with the new Danfoss Bond Buffer® technology, Danfoss offers outstanding reliability and significant performance. These innovative combination leads to a much longer lifetime and/or higher current density. Other significant advantages include additional thermal capacity, better short circuit performance and lower forward voltages.