DCM™ technology platform
DCM™ - The next generation direct liquid cooled power module technology platform for automotive traction applications
A key approach to meeting the stringent automotive requirements is the development of a new direct liquid cooled power module technology platform. Danfoss introduces the DCM™ technology platform that is especially suited to match the technical requirements of automotive traction inverters and is based on market leading technologies: Danfoss Bond Buffer® that combines sintered die attach and copper wire bonding, transfer molding processes for robust packages, to liquid cooling technologies namely ShowerPower® and SP3D®.
The DCM™1000 is a robust chip independent technology platform targeting the automotive drive train application in 650/750V with currents of 300-700 Arms. The design is flexible and fully customizable and designed to be wide band gap ready.
The new technology platform can be effectively integrated to electric traction drives and covers power ratings above 200kW and making it applicable for various drivetrain architectures.
Overall, the power module technology platform is well-defined, based on proven technologies, and yet scalable and customized to meet customers' specific mission profiles.
The Danfoss DCM™ power module technology platform for traction applications has been extended to cover 1200V semiconductors, either in Si or SiC.
Just like the DCM™1000, the DCM™1000X is designed to operate under the harshest conditions and meets the stringent requirements for automotive applications.