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Joining forces to develop power modules for the automotive market

28 September 2007
Danfoss Silicon Power partners with C-MAC MicroTechnology to co-develop and manufacture intelligent, compact power modules for the rapidly growing automotive business. C-MAC MicroTechnology is a world market leader in electronic systems, modules and components for the automotive segment, among others.
C-MAC and Danfoss Silicon Power will combine their expertise to develop intelligent power modules specifically to meet the demands of automotive applications, where the electronic systems need to be robust, reliable, lightweight and cost-effective. C-MAC will primarily provide expertise in the design of the electronic control circuit, while Danfoss Silicon Power will contribute with the power electronics.

The automotive market for intelligent and integrated power modules (IPMs) is growing strongly, driven by innovative applications, which increases the electrical and electronic content of vehicles. This again creates a demand for integrated power modules capable of controlling motors of up to several thousand watts.

“With this partnership, we will be able to take our existing designs on to a new level of cost and performance, opening up new applications for us,” says Claus A Petersen, President, Danfoss Silicon Power.


For further information:
Claus A. Petersen, President, Danfoss Silicon Power: +49 4621 95 12 312
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